Semiconductor UV Series Filters
The semiconductor ultraviolet filter is a multi-layer hard film TFF interference thin film filter, specially developed for wafer inspection, photolithography, thin film measurement, and semiconductor fluorescence defect detection. It is divided into three categories according to the ultraviolet band:
1. Deep UV DUV (185-300nm): 193nm (ArF), 248nm (KrF), 266nm, 280nm, photolithography, deep UV defect detection
2. Middle ultraviolet UVB (300-360nm): 313nm, 340nm, thin film thickness spectral detection
3. Near ultraviolet UVA (360-40nm): 365nm (i-line lithography), 405nm (g-line), mainstream optical path for mass production machines
Four mainstream categories&corresponding applications of semiconductors
1. UV narrowband bandpass filter BP-UV
Core function: Only passing through a single ultraviolet wavelength of the target, blocking stray light and laser plasma interference across the entire wavelength range, and improving the signal-to-noise ratio of defect imaging
2. Ultraviolet long/short wave pass filter LWP/SWP
LWP Long Wave Pass: Cut off short wave DUV, transmit target UV+visible light, separate excitation light from fluorescence receiving path
SWP Short Wave Pass: Cut off visible and infrared light, only transmit ultraviolet light, filter white light impurities at the light source end
Combined with a dichroic mirror to form a confocal ultraviolet detection optical path
3. UV neutral density ND attenuation film (variable density/fixed OD)
Balance UV laser power to prevent CCD/PD detector saturation
Multi channel wafer inspection machine unifies the UV light intensity of each channel to eliminate channel differences
Band neutrality: uniform attenuation of 190-400nm, no wavelength selectivity
4. UV notch filter Notch
Suppress the fundamental wave of strong ultraviolet laser and only transmit weak defect scattering signals for high-resolution dark field detection
Matching models for semiconductor segmentation scenarios
1. DUV deep ultraviolet lithography/measurement (193/248/266nm)
2. 365nm i-line lithography, wafer macroscopic defect detection
3. Spectral detection of film thickness (340nm)
4. 280nm deep ultraviolet micro defect scanning (advanced process 7nm/3nm)
BP280-3 ultra narrowband filter, OD6 deep cutoff, captures submicron defect fluorescence signals







